| Typical magnetic energy density window | 28-53 MGOe | <=16 MGOe (isotropic), up to ~25 MGOe (anisotropic) | 20-33 MGOe | Values are orientation windows from cited source sets; geometry and working point still shift usable output. | [S11] |
| Planning temperature ceiling | Commercial planning classes often run through AH around 220C (verify by curve and load-line) | Typically lower than sintered due to polymer binder constraints | Used as high-temperature fallback; IEC TR 62518 discusses elevated-temperature stability behavior | Use adjusted peak temperature, not ambient. Final limit must come from vendor curves under your duty profile. | [S9] |
| Shape freedom and manufacturing | Strong but brittle; machining tolerance management is critical | Higher shape freedom for complex and thin-wall geometries | Brittle ceramic-like behavior; machining control required | Shape complexity can justify bonded routes even when peak BHmax is lower. | [S11] |
| Corrosion baseline | Coating usually required (Ni-Cu-Ni, epoxy, or equivalent) | Binder contributes baseline protection but media compatibility must still be verified | Better inherent corrosion behavior in many environments | ASTM B117 / IEC 60068-2-11 are gate checks, not direct life models. | [S10] |
| Supply concentration exposure (2035 view) | High for Nd/Pr, and potentially Dy/Tb in high-temperature coercivity lanes | Still tied to rare-earth feedstock plus binder/process dependencies | Different critical-material exposure profile (includes cobalt) | IEA N-1 analysis shows concentration shock can leave only 35%-40% coverage for rare-earth linked chains. | [S4] |
| Measurement comparability baseline | Require demag curve + recoil line under disclosed method | Request the same measurement family and working-point disclosure | Normalize by same method before ranking across vendors | IEC 60404-5 and IEC 60404-18 describe measurement methods; IEC 60404-8-1 defines minimum property specifications. | [S6][S7][S8] |
| Best-fit program conditions | General high-flux motors, sensors, compact electromechanics | Complex geometry, high-volume molding, lower peak flux density demands | Very high-temperature or severe thermal-cycle duty | Always close loop with demag, corrosion, and thermal evidence before release. | [S5][S9] |